Tageos has expanded its RFID and NFC portfolio with the launch of new FlexIC-based inlay product lines, developed in partnership with Pragmatic Semiconductor, aimed at accelerating adoption of connected packaging and smart labeling applications.

The new EOS Lite and EOS Zero Lite families are designed specifically for high-volume labeling and packaging environments, combining ultra-thin flexible chip technology with antenna designs engineered to reduce material usage, carbon footprint, and overall cost.

For label converters, the development reflects a growing shift toward item-level intelligence, where packaging and labels are expected to deliver not only identification and traceability, but also consumer engagement and digital connectivity.

The first product in the range, the EOS-932 Zero Lite PR1301, is a paper-based NFC inlay optimized for integration into labels and paper packaging. By pairing a recyclable paper antenna with Pragmatic’s ultra-thin NFC Connect chip, the inlay supports improved recyclability while maintaining the performance needed for applications such as authentication, brand protection, and interactive consumer experiences.

Developed at the Tageos Innovation Center of Excellence, the new inlays are designed for seamless integration into existing converting workflows, enabling converters to incorporate NFC functionality without significantly altering label construction or appearance. The ultra-thin chip is effectively imperceptible once applied, allowing for discreet use across a wide range of packaging formats, including curved and flexible surfaces.

For converters and brand owners alike, the ability to embed connectivity directly into labels is becoming increasingly important as supply chains digitize and regulatory initiatives—such as digital product passports—gain traction. The new product lines are positioned to support these trends by enabling scalable deployment of connected labels while aligning with sustainability targets.

“Our close collaboration with Pragmatic Semiconductor combines innovation with a clear vision for sustainability, enabling customers to deliver highly scalable, cost-effective, and truly sustainable NFC inlays for smart packaging applications,” says Matthieu Picon, CEO of Tageos. “The new and growing FlexIC-based product lines EOS Lite and EOS Zero Lite are yet another example of our path to success, opening new possibilities for brands to connect to their customers through their products and the consumer’s most personal device, the smartphone.”

Pragmatic Semiconductor emphasized the role of flexible electronics in expanding access to item-level intelligence across packaging and labeling applications.

“Bringing this innovation to market is an exciting deployment of our FlexIC technology,” adds David Moore, CEO of Pragmatic Semiconductor. “With Tageos, we are addressing the rapidly expanding opportunity to seamlessly integrate intelligence at item level and deliver sustainable, connected experiences at scale.”

Prototype samples of the EOS-932 Zero Lite PR1301 are expected to be available by the end of Q2, with volume production planned for Q3 2026. Additional products in the FlexIC-based portfolio are expected to follow later this year.